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What is a stress tester? What areas do you use? What is the principle? Application is very wide

Introduction to equipment functions and principles

In the process of measurement motherboard (such as ICT, SMT, Function Test, Assemebly, etc.)) The deformation of the plate bending is used to verify whether it has a relatively impact on BGA tin points. Users can determine whether the measured signal data measured by the “maximum main stress, minimum main stress, shear stress, corresponding angle, Diagonal, etc. can determine whether the measured signal data meets international norms and standards? Take the important reference information of the export quality of 3C products such as a server, laptop calculator, PDA, and handheld phone.

working principle:

Balance the signal of the Strain GAGES through the Bridge of the Whison Bridge, which can be converted into the corresponding voltage signal. After the analog/digital circuit inside the tester, the voltage signal can be converted to a digital signal, and then dedicated to dedicated Software to capture and analyze these signals.

Device action flowchart

Put on, test,

Read data, analyze the deformation amount

Overall structure diagram

Equipment appearance, size, weight

Appearance: as shown in the figure

Size: about 445 width 315 high 125

Weight: about 3.72kg

Main indicators

1) Enter channel: 96 channel stress signal input

2) Maximum sampling rate: 2 KS/S/All Channel, high -speed synchronous collection

3) Support strain type type: 120Ω, 1/4 bridge

4) Simulator: 16 -bit resolution

5) Accuracy error: 0.5%(conventional measurement conditions 25 ℃, ± 5 ℃)

6) Filter: Anti -hybrid filter

7) Digital filter: User customized Qualcomm/Low Tong/Band/Tibetan resistance filtering

8) Stability: temperature drift gain is less than 6ppm

9) Full range range: ± 29.4mv/v (+20000ue/-20000UE)

10) Inter -terminal overvoltage protection: ± 30V

11) Case interface type: USB2.0

12) Power supply power supply: 11 to 30VDC, 220VAC

13) Work temperature: -40 ℃ ~ 70 ℃, operating humidity: 10% ~ 90% RH, no condensation storage temperature: -40 ℃ ~ 85 ℃, storage humidity: 5% ~ 90% RH, no condensation without condensation

14) Protection level: IP 40

15) Response film connection method: high -quality terminal wiring box

16) One -click automatically generate report and judge Pass or Fail

The main module list is as follows:

Serial number


Functional requirement




Data collection instrument

Data collection transmission



connecting cables

Connection between instruments and wiring boxes





Junction Box

Convenient for the connection between the strain and the instrument


Environmental requirements

Temperature and humidity, working temperature: -40 ℃ ~ 70 ℃, working humidity: 10% ~ 90% RH, no condensation storage temperature: -40 ℃ ~ 85 ℃, storage humidity: 5% ~ 90% RH, no condensation without condensation

Protection level: IP 40